Micron, a trailblazer in memory technology, has unveiled an impressive lineup of advancements, including the world’s fastest HBM3 Gen2 memory with a remarkable speed of 1.2 TB/s, along with 32GB DDR5 chips.

This groundbreaking development marks a significant stride in memory technology, as Micron gears up to not only mass produce 32GB DDR5 chips but also introduce higher capacity modules by the first half of 2024. The company’s commitment to innovation is evident in its utilization of the cutting-edge 1β (1-beta) process, a state-of-the-art manufacturing technique that bypasses extreme ultraviolet lithography.

Though the specific data rates of the new 32GB blocks have not been disclosed, these chips hold immense potential, opening the door to the creation of 1TB DDR5 modules. However, Micron is treading cautiously and plans to initially offer 128GB modules next year, prioritizing a balanced and effective approach to memory capacity.

Micron’s revolutionary HBM3 Gen2 memory boasts a total bandwidth of 1.2TB/s across an 8-level stack, with a maximum capacity of 24GB (and soon-to-be-introduced 36GB circuits). A noteworthy enhancement compared to its predecessor, HBM2E, is the remarkable 2.5-fold increase in energy efficiency, a testament to Micron’s commitment to driving not only performance but also sustainability.

Looking forward, Micron’s visionary roadmap includes plans for HBMNex memory, a potential successor in the form of HBM4. This forthcoming memory iteration is anticipated to deliver a staggering 2+ TB/s bandwidth and support capacities of up to 64GB by the year 2026.

Micron’s latest achievements underscore its unwavering dedication to pushing the boundaries of memory technology. By introducing cutting-edge solutions like the HBM3 Gen2 memory and 32GB DDR5 chips, the company is not only meeting the demands of the digital age but also laying the foundation for a future where memory capabilities reach new heights.